INTERFLUX 00-322 Warszawa ul. Krakowskie Przedmieście 66 tel. (48 22) 828 48 68 fax. (48 22) 826 59 88 mobile. 0-601 26 90 27 NIP 123-000-47-98 |
interflux.electronics@bigvent.com.pl
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INTERFLUX logistic dep. 87-100 Toruń ul. Kociewska 28/30 tel. 0-601 89 11 30 |
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DESCRIPTION
MEC HASL FLUX W-2308 is a water-soluble,
organic acid type flux specially designed for use in hot air levelling
operation of SMD boards application.
The fluxing activity is at optimum when boards are well dried prior
to fluxing.
All of our experience and expertise both in the oil and infrared
solder fusing have been used to develop this unique flux.
FEATURES
PHYSICAL PROPERTIES
Form : Viscous liquid
Viscosity(cps /20°C) : 105 ą 30
pH (1%aqueous sol.20°C) : 2.9 ą 0.5
Appearance : Amber clear liquid
Specific gravity(20°C) : 1.145
Flashpoint : Non flammable : 275°C
Board Surface Insulation Resistance
OPERATING CONDITIONS
General machine settings :
The copper surface must be well cleaned prior to solder levelling.
Therefore we recommend to use MEC Brite CA-.. as soft etch to prepare the
copper surface.
MEC Brite CA-.. will remove oxides and other residues and leave
an ideal copper surface for proper levelling.
MEC Brite CA-.. is completely water soluble.
POST CLEANING
Most efficient cleaning is obtained when using rinsing water at a
temperature between 25 and 40°C.
Use of soft nylon brushes also assists in better post cleaning.
STORAGE AND HANDLING
Available in 25L and 200L polyethylene drums.
The information contained herein is believed to be correct,
but each user is advised to ensure that the product is suitable for his
own purposes before he uses it.The purchaser is solely responsible for
any loss, either directly or indirectly arising from the use of this product,
or information contained herein.
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