INTERFLUX 00-322 Warszawa ul. Krakowskie Przedmieście 66 tel. (48 22) 828 48 68 fax. (48 22) 826 59 88 mobile. 0-601 26 90 27 NIP 123-000-47-98

interflux.electronics@bigvent.com.pl

INTERFLUX logistic dep. 87-100 Toruń ul. Kociewska 28/30 tel. 0-601 89 11 30

DESCRIPTION

MECBRITE CA-95 is an acidic micro-etch cleaner specifically formulated to remove organic and inorganic soils such as fingerprints, light oils and oxides from copper surfaces before horizontal Hot Air Levelling where fast re-activation of copper is required. MECBRITE CA-95 is supplied as ready-to-use solution. The CA-95 M is the Make-up (Starter) solution. To replenish CA-95 R should be used.

USE

1. Copper cleaning prior to the horizontal hot air levelling process.
2. Cleaning of copper prior to conveyorized processing systems, such as: - Inline dry film lamination - Black oxide etc.
3. Remove copper deposit on racks from electroplating.

1. Provides complete cleaning. No need of sulphuric acid rinse to remove smut or to neutralize.
2. Reduced contents of organic simplifies waste treatment. Minimal COD is needed.
3. Does not attack stainless steel.
4. May be used for both spray and soak applications.
5. Does not produce hazardous fumes in operation.
6. Can be applied at room temperature.

• Cleaning
• Microetching
• Very mild tarnish inhibition

HOW TO USE

1. Bath Make-up

Make with CA-95M and replenish with CA-95R.
2. Working condition

Temperature used : 20-25°C
Time used : 20-45 seconds for immersion. Less than 10 seconds in spray at pressure of ca 0.5 to 0.7 kg/cm².
• For immersion use, agitate well and use it in a uniform state.
• Boards on racks shall be so arranged as to leave at least 1cm space between them. If the boards are stacked close, the temperature of the bath will increase, resulting in overetching.
• The boards removed from the bath should be thoroughly rinsed with water and dried immediately.
3. How to replenish

Choose one from the following 3 methods to determine when to replenish.
• By the dragged-out volume.
• By the process board area.

Add 1L replenisher per 3 to 5 m² processed surfaces. (Calculated as the copper surface area is 30% of the boards)
• By the hydrogen peroxide concentration.

Maintain 35 %-hydrogen peroxide contents not less than 65 g/l.
4. By copper control in feed and bleed.

To insure the optimum etch rate, analyse quantitatively hydrogen peroxide and copper contents, using the procedures described below :

(Operating Range) :

	Maximum (g/l)	Minimum (g/l)
35 % H2O2	110	65
Cu	45	10
H2SO4	165	90

 
*Note : Etching rate should be maintained between 0.7 and 1 ľ/min.
 

ANALYTICAL CONTROLS

A. H₂O₂

KMnO4 titration method

1. Pipette 1 ml of CA-95 bath solution.
2. Add 50 ml of deionized water and 5 ml of 50%-H2SO4.
3. Mix well and titrate with 0.10 N-KMnO4 to a pink endpoint.
4. Calculation :

35 % H₂O₂ (g/l) = 4.857 x f x V
where f = the factor of 0.10N- KMnO₄, V = the titrated volume (ml)

1. Pipette 1 ml of CA-95 bath solution into a 100 ml beaker.
2. Add 50 ml of deionized water.
3. While agitating, titrate with 0.10N-NaHS0₃ (10.4 g/l NaHS0₃)to an endpoint where the potential drops fast.
4. Calculation :

35 % H₂O₂ (g/l) = 9.71 x f x V
where f = the factor of 0.10N-NaHS0₃,V = the titrated volume (ml)

B. Cu 

1. Pipette 1 ml of CA-95 bath solution.
2. Add 50 ml of deionized water.
3. Add aqueous ammonia to a blue endpoint.
4. Add 0.2 g of 0.4%-Murexide reagent (diluted Potassium Sulfate)
5. Titrate with 0.025M-EDTA 2Na from a reddish yellow to a purple endpoint.
6. Calculation :

Cu (g/l) = 1.5885 x f x V
where f = the factor of 0.025M-EDTA 2Na, V = the titrated volume (ml)

1. Pipette 1 ml of CA-95 bath solution.
2. Add 50 ml of deionized water.
3. Add 2 to 3 drops of Methyl Orange indicator.
4. Titrate with 0.50N-NaOH from a reddish orange to a yellow endpoint.
5. Calculation :

H₂SO₄ (g/l) = 24.5 x f x V
where f = the factor of 0.50 N-NaOH, V = the titrated volume (ml)

1. Take some solution out of the bath and put them into a beaker.
2. Put the board into a beaker.
3. While sometimes agitating, measure the time (T min.) when the half of the substrate under the copper surface is appeared.

Etching Rate (ľm/min) = 18 (or 35)/T

Do not incline the board too much.

OPERATING CAUTIONS

1. Do not contaminate the CA-95 bath with precious or heavy metals (especially the iron ion). These contaminations may accelerate the decomposition of hydrogen peroxide.
2. Do not contaminate CA-95 bath with anything made of iron. Contamination may cause a violent chemical reaction.
3. Chloride ion mixed into the bath will decrease etching rate.

The use of city water into the bath should be avoided.
4. Nickel connectors on boards shall be protected with tapes, for MECBRITE CA-95M/CA-95R will etch nickel.

1. Provide adequate ventilation in the working area.
2. MECBRITE CA-95 contains strong oxidants. When working with these products, wear gloves and chemical goggles to avoid contact with skin and eye. If it comes into contact with the skin or clothing, flush thoroughly with water and if eye contact occurs, obtain medical aid after flushing with water.
3. Even for storage of CA-95 used solution, use polyethylene containers whose caps are designed to release gas and store them in a cool and dark place where the direct sunlight is not received.
4. When leaking CA-95, add water and neutralize with slaked lime.

1.  MECBRITE CA-95 will corrode titanium. In choosing materials for the equipment, consult our staff for details.
2. Conveyorized machines for this process shall be equipped with adequate ventilation system (exhaust duct).
3. Provide a cooling coil or chiller in order to control the solution temperature.

Spent solution itself should be handled by professional waste treatment toller.

Rinsing water and/or diluted solution should be handled as follows :
 

This method will result in an end-concentration of Cu of less than 1ppm in the filtered water.
 

PACKAGING

MECBRITE CA-95 M is available in 60 L polyethylene drums.
MECBRITE CA-95 R is available in 60 and 200 L polyethylene drums and 1000 L re-usable containers.
 
 

The information contained herein is believed to be correct, but each user is advised to ensure that the product
is suitable for his own purposes before he uses it. The purchaser is solely responsible for any loss, either directly or indirectly arising from the use of this product, or information contained herein.
 

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