INTERFLUX 00-322 Warszawa ul. Krakowskie Przedmieście 66 tel. (48 22) 828 48 68 fax. (48 22) 826 59 88 mobile. 0-601 26 90 27 NIP 123-000-47-98

interflux.electronics@bigvent.com.pl

INTERFLUX logistic dep. 87-100 Toruń ul. Kociewska 28/30 tel. 0-601 89 11 30

MECetchBOND CZ-8100 is a single stage copper surface treatment process which is capable to entirely replace the Black Oxide process for innerlayers.
Many of the typical imperfections of the Black Oxide process can be resolved easily by MecEtchBond CZ-8100.
MecEtchBond is the very latest technology invented, formulated and patented by Mec Company Ltd.

The highly efficient electronic appliances are nowadays in great demand besides the compact and light-weight electronic appliances. Thus, various PWB processes are introduced in order to respond to such demands.

Our newly-developed MECetchBOND CZ-8100 now introduced to you can provide a unique copper surface topography which is not possible to get with any conventional chemical cleaning. This enhances the adhesion between the copper and the resin.

Unlike other technics, MECetchBOND CZ-8100 can easily be employed without requiring the complicated control.

Our newly-developed MECetchBOND CZ-8100 will contribute much to your solution of various problems as well as the improvement of the productivity with the simplification of the process.
 

FEATURES

1. No pinkring (haloing).

Produces no copper oxide on copper surface.
Produces roughened copper surface excellent for adhesion to resin.
 
2. High work efficiency.

Easy to conveyorise, unlike Black Oxide treatment, which will provide high productivity.
 
3. Simple control.

Can basically be controlled by copper concentration only.
 
4. Easy waste treatment.

Separation of copper by general neutralisation coagulation method.
 
5. Improved working environment.

High working temperature is not required as in Black Oxide treatment, which will result in energy saving.
 
6. Reduced process steps I

This will not only reduce in equipment investment, but also in cc #7,
 
7. Reduced process steps less rinse water consumption and so also less in water treatment cost.

 
8. Strong adhesion of copper and resin.

Possible to improve adhesion of copper and resin in build-up structure of ML. ML developed in Japan by IBM.
 
9. Capable of roughening hard-to-etch materials such as rolled copper and copper alloy.

Can be applied to flexible PCB and lead frame.
 
10. High copper holding capacity.

 

MICRO-ETCH  CZ-8100 make-up  Refer to USAGE & CONTROL  for replenishment	30 - 40°C (standard 35°C)  Spray pressure : 1 - 2 kg/cm?  Etch rate : approx. 1.5 (to 4) ľm  (treatment time : 45-90 sec.)
WATER RINSE
ACID RINSE PC-8200 (2 time dilution) or 10.0% hydrochloric acid	20 - 30°C  Spray pressure : 0.3-0.6 kg/cm?  Treat for 10-15 sec.
WATER RINSE (over 2 steps)
DRY

For details, refer to the drawing of our standard machine.
 

PHYSICAL PROPERTIES
 

Item	MecEtchBond CZ-8100M	MecEtchBond CZ-8100R
Appearance	Blue clear liquid	Colorless-light Yellow clear liquid
Specific gravity (At 20°C)	1.13 ą 0.01	1.11 ą 0.01
pH	3.4 ą 0.5	3.1 ą 0.5

 
R : replenisher solution
M : starter
 
 

USAGE AND CONTROL

HOW TO USE

1. Use CZ-8100 for bath make-up.

- For replenishment, refer to ‘control method’ mentioned below.
2. Process in spray at temperature : 30-40°C (standard 35°C).

- Oxygen is required in the reaction.
3. Use a ‘de-smuth’ rinse with 10% of hydrochloric acid.

Control of copper concentration

a) Analytical :

Read copper concentration according to ‘Analytical Method’.
 
1. When the copper concentration is below 15g/liter, add fresh CZ-8100 to fill up the solution level.
2. When the copper concentration is 15-45g/liter, add fresh CZ-8100 to fill up the solution level.
3. When the copper concentration is over 45g/liter, take out 5/8 of the used solution and add fresh CZ-8100

Automatic copper control
The Walchem W-10 series copper controllers are available from Mec Europe.
 

c) By density control :

1. Measure SG of CZ-8100 solution at 30 ą 1°C (A).
2. Read SG which corresponds to the analytical measured coper concentration from the graphic (B).
 
 

	B - A
Concentration x (%) =		x 100
	B(1 - A)

 

When concentration (X) is :

 

- 10%		change whole solution
- 10% ~ + 10%		Use as it is
+ 10% ~ + 20%		add D.I. water in accordance with formula below
+ 20%		change whole solution

 
 

	tank volume (kg) x 100
D.I. water (1) =		- tank volume (kg)
	100 - concentration (%)

 

Measure the acidity by titration
cc. analytical procedures :

Maintain the bath as follows :
Acid : below 1.0N - change all into fresh solution
 

Control of concentration and dilution.

Read from the copper concentration mentioned above and SG mentioned in the following page; (Be careful of the temperature when measuring.)

Dilution > 1O% : change all into fresh solution.
Concentration & Dilution < 1O% : use as it is.
Concentration 1O-2O% : correct by adding deionized water.
Concentration over 2O% : change all into fresh solution.

In case that the solution may be diluted or concentrated, check the process line.

Dilution : Rinse water drag in or damage of cooling pipe, ect.
Concentration : Too much extraction of exhaust duct of bad control of temperature, etc.
 

Control of cleaner

Read from the acidity according to “ Analysis Method”.

PC-82OO (2-time dilution) : < 0.10N : change all into fresh solution.
10.O% hydrochloric acid : < 1.O N : change all into fresh solution.

 
Calculation in case of concentration or dilution

 

	B - A
X =		x 1OO
	B(1 - A)

A : Measured specific gravity
B : Graph value at the analysed concentration
 

Copper

1. Pipette 1ml of CZ-8100 bath and add 50ml of deionized water.
2. Add aqueous ammonia to a dark blue endpoint.
3. Add 0.2g of 0.4%-Murexide reagent (diluted potassium sulphate).
4. Titrate with 0.025 M-EDTA from a reddish yellow to a purple endpoint.

1.5885 x f x V = g/1 Cu
where, f = the factor of 0.025 M-EDTA (should be = 1)
V = the titrated volume (ml)

Board : Scrubbed copper clad panel 10 x 10 cm

Process : Measure the board weight to the third decimal point (0.001)*

Example : Double-sided board = (initial weight *1 - treated weight *2) 8.9 x 50
 

Acidity of de-smuth

1. Pipette 1 ml of solution and add 50 ml of deionized water.
2. Add 2-3 drops of the reagent (Phenolphthalein).
3. Titrate with 0.O1 N NaOH for cleaner and O.1N NaOH for hydrochloric acid to a reddish purple endpoint.

Acidity (N) of cleaner = O.01 x f x V
Acidity (N) of hydrochloric acid = 0.1 x f x V

where, f = the factor of NaOH (should be = 1)
V = the titrated volume (ml)

EQUIPMENT MATERIAL
 

MATERIAL		MATERIAL
SS 3O4	X	Rigid PPE	0
SS 316	X	Soft EPT	X
Titanium	0	Soft PVC	0
Rigid PVC	0	Soft thermorun	D
Rigid PP	0	Foamed polymer	0
Rigid PE	0	SS welded	X
Rigid ulmoler/PE type resin	0	Titanium welded	0

 

0 : Usable, X : Not usable, D : Partly usable

Stainless steel metal parts cannot be used !

* For mark D , contact our Research and Development Division for further information.

1. Provide adequate ventilation in the working area.

 
2. Do not let the solution leak when it is taken out of the container or into the container.

 
3. When handling, wear protective coverings such as gloves and goggles to avoid contact with hands, legs, skin and eyes.

 
4. Wash hands and mouth after handling.

 
5. Keep the container tightly sealed in a cool and dark place away from direct sunlight.

 
6. Absorb with sand and remove when leaked.

 PHYSICAL PROPERTIES

DELAMINATION CHECK

Compared the deteriorated solder heat resistance based on JIS C 6481.

Delamination 1

Boil at 100°C for 4 hours Heat stress at 260°C
Solder float for 60 seconds

MecEtchBond and Black Oxide treatment caused no blistering, separation or delamination.

Delamination 2.

Pressure-cooker test
121°C, 2atm, 2 hours Heat stress at 260°C
Float on solder for 1 min.
 

Copper concentration	15g/l	30g/l	45g/l
CZ-81OO (old version)	0	D ~ 0	----
CZ-81OO	0	0	0

 
0 : No delamination.
D : May cause delamination.
X : Cause delamination.
 

CZ-81OO, even under the copper holding capacity 45g/l, keeps high solder heat resistance without causing any delamination

 
MecEtchBond RELIABILITY

1. Electric insulation

Board : Comb type D (glass epoxy G-10 JIS Z 3197 4.1)
Humidification : 40°C . 95% RH

Board : Copper clad (Plain)
Measuring instrument : Omega meter 600 SMD

WASTE TREATMENT

Rely on disposal contractor for disposing of spent solution and water rinse containing much solution.
For disposal of 1st water rinse, perform treatment according to neutralisation coagulation method.

Example of 1st rinse water treatment

 

1st rinse water
Inorganic coalgulator	Add Ferric Chloride (Possible to use PAC and Aluminium Sulphate)
Neutralisation	Add 10-20% slaked lime or caustic soda
Anion type high polymer coagulator
Solid-solution separation
Supernatant solution discharging

 
 

	Before treatment	After treatment
Copper concentration (ppm)	4000	1 >

 

The information contained herein is believed to be correct, but each user is advised to ensure that the product is suitable for his own purposes before he uses it.The purchaser is solely responsible for any loss, either directly or indirectly arising from the use of this product, or information contained herein.

 

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