PuckPack TM

NEW

 PuckPack - The Captive Solder Paste Print Head System - PuckPack
     
 

 

Retrofit your Stencil Printer Machine with the PuckPackTM System and enjoy the following Benefits :

  1. Cost Saving

  2. No Solder Paste dry out

  3. No squeegees needed

  4. Minimum Setup time

  5. Minimum Waste of Solder Paste

  6. Process repeatability

  7. High Speed Printing

  8. Less Cleaning
Low Investment Please fill in the questionnaire and send it back to Interflux.  We will be able to suggest the correct Interface and estimate your Cost Savings.

Click here to view and save the Questionnaire
Standard Interface Available

DEK

Click here to download the Installation Instructions

MPM

Click here to download the Installation Instructions

MPM-Prohead

Click here to download the Installation Instructions

EKRA

Click here to download the Installation Instructions